Faculty Profile

Huck Beng Chew

Aerospace Engineering
Huck Beng Chew
Huck Beng Chew
Assistant Professor
306H Talbot Laboratory MC 236
104 S. Wright
Urbana Illinois 61801
(217) 333-9770

Administrative Titles

Education

  • National University of Singapore Doctor of Philosophy, Mechanical Engineering, 2007. Thesis: A Mechanism-Based Approach: Void Growth and Coalescence in Polymeric Adhesive Joints. Field: Micromechanics of Materials.
  • National University of Singapore Master of Engineering, Mechanical Engineering (Accelerated Masters Program), 2003
  • National University of Singapore Bachelor of Engineering (1st Class Honors; University Scholar Program), Mechanical Engineering, 2002

Biography

Huck Beng Chew obtained his Bachelor, Masters, and his PhD degree in Mechanical Engineering from the National University of Singapore in 2001, 2003, and 2007. He did his postdoctoral studies at Brown University, Providence, RI, from 2008-2011 where he was promoted to Assistant Professor of Research at Brown University in 2011. He is currently an Assistant Professor with the Aerospace Engineering Department, where he conducts research on the nano and micro mechanics of small-scale material structures using computational-based simulations. Huck Beng is a Fellow of the Institute of Mechanical Engineers, and is a registered Chartered Environmental Engineer.

Academic Positions

  • University of Illinois, Urbana-Champaign, IL Affiliate Assistant Professor, Computational Science and Engineering, Sept 2011-Present
  • University of Illinois, Urbana-Champaign, IL Assistant Professor, Aerospace Engineering, Aug 2011 ￿ Present
  • Brown University, Providence, RI Assistant Professor (Research), School of Engineering, June ￿ Aug 2011
  • Brown University, Providence, RI Postdoctoral Research Associate, School of Engineering, Jan 2008 ￿ June 2011. Field: Nanomechanics of Materials.

Professional Registrations

  • Fellow of the Institute of Mechanical Engineers, FIMechE (since 2014; member since 2007)
  • Registered Chartered Engineer (UK) CEng (since 2007)

Teaching Statement

To bring research to the classroom, with demonstration of cutting edge research to undergraduate and graduate students.

Research Statement

To understand the fracture and failure processes of small-scale material structures through bridging the nano and micromechanics of materials using multi-scale modeling and simulations.

Post-Doctoral Research Opportunities

No post-doc openings at the moment.

Graduate Research Opportunities

Graduate students interested in working in the area of nano and micromechanics of materials, with strong interest in computational simulations, are welcome to apply.

Undergraduate Research Opportunities

Currently accepting applications as part of the UROP, REU, ISUR program. Female students, and underrepresented minority students are especially encouraged to apply.

Chapters in Books

  • Chew, H.B., Guo, T.F. and Cheng, L., Mechanism-based modeling of thermal and moisture induced failure of IC devices, in: Moisture Sensitivity of Plastic Packages of IC Devices, Chapter 12. Editors: Fan, X.J. and Suhir, E. 1st Edition, Springer 2010, pp. 301-331, ISBN: 978-1-4419-5718-4.

Selected Articles in Journals

Honors

  • Vice Chancellor￿s List (2002)