Faculty Profile

• Overview
• Academics
• Research
• Publications
• Honors

Education

• National University of Singapore Doctor of Philosophy, Mechanical Engineering, 2007. Thesis: A Mechanism-Based Approach: Void Growth and Coalescence in Polymeric Adhesive Joints. Field: Micromechanics of Materials.
• National University of Singapore Master of Engineering, Mechanical Engineering (Accelerated Masters Program), 2003
• National University of Singapore Bachelor of Engineering (1st Class Honors; University Scholar Program), Mechanical Engineering, 2002

Biography

Huck Beng Chew obtained his Bachelor, Masters, and his PhD degree in Mechanical Engineering from the National University of Singapore in 2001, 2003, and 2007. He did his postdoctoral studies at Brown University, Providence, RI, from 2008-2011 where he was promoted to Assistant Professor of Research at Brown University in 2011. He is currently an Assistant Professor with the Aerospace Engineering Department, where he conducts research on the nano and micro mechanics of small-scale material structures using computational-based simulations. Huck Beng is a Fellow of the Institute of Mechanical Engineers, and is a registered Chartered Environmental Engineer.

Academic Positions

• University of Illinois, Urbana-Champaign, IL Affiliate Assistant Professor, Computational Science and Engineering, Sept 2011-Present
• University of Illinois, Urbana-Champaign, IL Assistant Professor, Aerospace Engineering, Aug 2011 ￿ Present
• Brown University, Providence, RI Assistant Professor (Research), School of Engineering, June ￿ Aug 2011
• Brown University, Providence, RI Postdoctoral Research Associate, School of Engineering, Jan 2008 ￿ June 2011. Field: Nanomechanics of Materials.

Professional Registrations

• Fellow of the Institute of Mechanical Engineers, FIMechE (since 2014; member since 2007)
• Registered Chartered Engineer (UK) CEng (since 2007)

Teaching Statement

To bring research to the classroom, with demonstration of cutting edge research to undergraduate and graduate students.

Research Statement

To understand the fracture and failure processes of small-scale material structures through bridging the nano and micromechanics of materials using multi-scale modeling and simulations.

Post-Doctoral Research Opportunities

No post-doc openings at the moment.

Graduate Research Opportunities

Graduate students interested in working in the area of nano and micromechanics of materials, with strong interest in computational simulations, are welcome to apply.

Undergraduate Research Opportunities

Currently accepting applications as part of the UROP, REU, ISUR program. Female students, and underrepresented minority students are especially encouraged to apply.

Chapters in Books

• Chew, H.B., Guo, T.F. and Cheng, L., Mechanism-based modeling of thermal and moisture induced failure of IC devices, in: Moisture Sensitivity of Plastic Packages of IC Devices, Chapter 12. Editors: Fan, X.J. and Suhir, E. 1st Edition, Springer 2010, pp. 301-331, ISBN: 978-1-4419-5718-4.

Selected Articles in Journals

• Wang, H., and Chew, H.B., Nanoscale mechanics of the solid electrolyte interphase on lithiated-silicon electrodes. ACS Applied Materials and Interfaces, 9(2017), 25662-25667.
• Li, R., and Chew, H.B., Grain boundary traction signatures: Quantifying the asymmetrical dislocation emission processes under tension and compression. Journal of the Mechanics and Physics of Solids, 103(2017), 142-154.
• Harpale, A., and Chew, H.B., Hydrogen-plasma patterning of multilayer graphene: mechanisms and modeling. Carbon, 117(2017), 82-91.
• Li., R., and Chew, H.B., Grain boundary traction signatures: Quantitative predictors of dislocation emission. Physical Review Letters, 117(2016), 085502.
• Wang, H., and Chew, H.B., Molecular dynamics simulations of plasticity and cracking in lithiated silicon electrodes. Extreme Mechanics Letters, 9 (2016), 503-513.
• Harpale, A., Panesi, M., and Chew, H.B., Plasma-graphene interaction and its effects on nanoscale patterning. Physical Review B, 93 (2016), 035416.
• Wang, X., Fan, F., Wang, J., Wang, H., Tao, S., Yang, A., Liu, Y., Chew, H.B., Mao, S.X., Zhu, T., and Xia, S., High damage tolerance of electrochemically lithiated silicon. Nature Communications, 6 (2015), 8417.
• Wang, H., Wang, X., Xia, S., and Chew, H.B., Brittle-to-ductile transition of lithiated silicon electrodes: Crazing to stable nanopore growth. The Journal of Chemical Physics, 143 (2015), 104703.
• Li, R., and Chew, H.B., 'Closed and Open-Ended Stacking Fault Tetrahedra Formation along the Interfaces of Cu-Al Nanolayered Metals. Philosophical Magazine, 95 (2015), 2747-2763.
• Wang, H., Hou, B., Wang, X., Xia, S., and Chew, H.B., Atomic-scale mechanisms of sliding along an interdiffused Li-Si-Cu interface. Nano Letters, 15 (2015), 1716-1721.
• Harpale, A., Panesi, M., and Chew, H.B., Communication: Surface-to-bulk diffusion of isolated versus interacting C atoms in Ni(111) and Cu(111) substrates: A first principle investigation. The Journal of Chemical Physics, 142 (2015), 061101.
• Li, R., and Chew, H.B., Planar-to-wavy transition of Cu/Ag nanolayered metals: A precursor mechanism to twinning. Philosophical Magazine,95 (2015), 1029-1048.
• Chew, H.B., Hou, B., Wang, X., and Xia, S., Cracking mechanisms in lithiated silicon thin film electrodes. International Journal of Solids and Structures, 51 (2014), 4176-4187.
• Li, R., and Chew, H.B., Deformation twinning and plastic recovery in Cu/Ag nanolayers under uniaxial tensile straining. Philosophical Magazine Letters, 94 (2014), 260-268.
• Chew, H.B., Cohesive zone laws for fatigue crack growth: Numerical field projection of the micromechanical damage process in an elasto-plastic medium. International Journal of Solids and Structures, 61 (2014), 1410-1420.
• Anderson, E., Li, R., and Chew, H.B., Negative stiffness induced by shear along wavy interfaces. Journal of the Mechanics and Physics of Solids, 63 (2014), 285-297.
• Chew, H.B., Inverse extraction of interfacial tractions from elastic and elasto-plastic far-fields by nonlinear field projection. Journal of the Mechanics and Physics of Solids, 61 (2013), 131-144.
• Kim, S.-W., Chew, H.B., Kumar, S., In situ TEM study of crack-grain boundary interactions in thin copper foils. Scripta Materialia, 68 (2013), 154-157.
• Kim, S.-P., Chew, H.B., Chason, E., Shenoy, V.B. and Kim, K.-S., Nanoscale mechanisms of surface stress and morphology evolution in FCC metals under noble-gas ion bombardments. Proceedings of the Royal Society A, 468 (2012), 2550-2573. Highlighted in NSF: http://nsf.gov/news/news_summ.jsp?cntn_id=124413
• Kim, H.-G., Chew, H.B. and Kim, K.-S., Inverse extraction of cohesive zone laws by field projection method using numerical auxiliary fields. International Journal for Numerical Methods in Engineering, 91 (2012), 516-530.
• Chew, H.B., Moon, M.-W., Lee, K.R. and Kim, K.-S., Compressive dynamic scission of carbon nanotubes under sonication: fracture by atomic ejection. Proceedings of the Royal Society A, 467 (2011), 1270-1289. Highlighted in Nature, 468 (2010), 870-871. Highlighted in NSF: http://www.nsf.gov/news/news_summ.jsp?cntn_id=118277
• Chew, H.B., Hong, S. and Kim, K.-S., Cohesive zone laws for void growth ￿ II. Numerical field projection of elasto-plastic fracture processes with vapor pressure. Journal of the Mechanics and Physics of Solids, 57 (2009), 1374-1390.
• Hong, S., Chew, H.B. and Kim, K.-S., Cohesive zone laws for void growth ￿ I. Experimental field projection of crack-tip crazing in glassy polymers. Journal of the Mechanics and Physics of Solids, 57 (2009), 1357-1373.
• Cheong, W.G., Chew, H.B., Guo, T.F. and Cheng, L., Thermo-mechanical analysis of Plastic Ball Grid Arrays with vapor pressure effects. IEEE Transactions on Components and Packaging Technologies, 32 (2009), 12-19.
• Chew, H.B., Guo, T.F. and Cheng, L., Influence of nonuniform initial porosity distribution on adhesive failure in electronic packages. IEEE Transactions on Components and Packaging Technologies, 31 (2008), 277-284.
• Chew, H.B., Guo, T.F. and Cheng, L., Pressure-sensitive ductile layers ￿ II. 3D models of extensive damage. International Journal of Solids and Structures, 44 (2007), 5349-5368.
• Chew, H.B., Guo, T.F. and Cheng, L., Pressure-sensitive ductile layers ￿ I. Modeling the growth of extensive damage. International Journal of Solids and Structures, 44 (2007), 2553-2570.
• Chew, H.B., Guo, T.F. and Cheng, L., Effects of pressure-sensitivity and plastic dilatancy on void growth and interaction. International Journal of Solids and Structures, 43 (2006), 6380-6397.
• Chew, H.B., Guo, T.F. and Cheng, L., Vapor pressure and voiding effects on thin film damage. Thin Solid Films, 504 (2006), 325-330.
• Chew, H.B., Guo, T.F. and Cheng, L., Vapor pressure and residual stress effects on mixed mode toughness of an adhesive film. International Journal of Fracture, 134 (2005), 349-368.
• Chew, H.B., Guo, T.F. and Cheng, L., Vapor pressure and residual stress effects on the failure of an adhesive film. International Journal of Solids and Structures, 42 (2005), 4795-4810.
• Chew, H.B., Guo, T.F. and Cheng, L., Vapor pressure and residual stress effects on the toughness of polymeric adhesive joints. Engineering Fracture Mechanics, 71 (2004), 2435-2448.

Honors

• Vice Chancellor￿s List (2002)